CST: 25/10/2016 01:41:13   

STATS ChipPAC Ranked in Top 10 Semiconductor Equipment Manufacturing Companies by IEEE for Patent Innovations

280 Days ago

Highest Ranking Ever Received for an OSAT Provider

SINGAPORE -- JANUARY 19, 2016, UNITED STATES--(Marketwired - Jan 18, 2016) -  STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked among the world's top 10 semiconductor equipment manufacturing companies in the 2015 Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers (IEEE), the world's largest professional association for the advancement of technology. This is the sixth consecutive year that STATS ChipPAC has been recognised in the annual scorecards.

The 2015 Patent Power Scorecards are based on objective, quantitative benchmarking of U.S. Patent and Trademark Office records by 1790 Analytics, an Intellectual Property (IP) evaluation firm. The patent portfolios of more than 6,000 leading commercial enterprises, academic institutions, nonprofit organizations, and government agencies worldwide were reviewed through the end of 2014. The scorecards rate the most valuable IP portfolios based on several factors including the size of an organization's patent portfolio, quality, impact, originality and general applicability.

STATS ChipPAC was ranked seventh in the Semiconductor Equipment Manufacturing category. This is the highest ranking ever received by an Outsourced Semiconductor Assembly and Test (OSAT) provider. STATS ChipPAC has been the leading U.S. patent holder among OSAT providers worldwide since 2011. By the end of 2014, STATS ChipPAC had been granted 1,346 patents by the U.S. Patent and Trademark Office (USPTO). Over the years, STATS ChipPAC has built up a patent portfolio in which advanced or future technologies comprise more than 65% of its IP, significantly higher than other OSATs in the industry.

"We are continually driving innovations in both advanced package design and our manufacturing processes to deliver the best solutions for our customers. We have focused our IP development in key areas such as wafer level packaging, flip chip interconnection, System-in-Package (SiP), 2.5D and 3D integration where we can provide our customers with differentiating solutions in the markets they serve," said Shim Il Kwon, Chief Technology Officer, STATS ChipPAC.

In August 2015, Jiangsu Changjiang Electronics Technology Co. Ltd. ("JCET"), headquartered in Jiangyin, Jiangsu, China, through its subsidiary JCET-SC (Singapore) Pte Ltd, acquired the entire shareholding of STATS ChipPAC. With over 1,500 patents issued by the USPTO as of the end of 2015 and 784 patents granted by the State Intellectual Property Office of China, the JCET Group has a combined IP portfolio that is unmatched in the OSAT industry with a deep knowledge base that provides a powerful competitive advantage for customers in the marketplace.

Forward-Looking Statements
Certain statements in this release, including statements regarding the Company's expectations and intentions relating to the issue of the New Notes and use of proceeds thereof, are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; shortages in supply of key components and disruption in supply chain; disruption of our operations and other difficulties related to the relocation of our China operations; loss of directors, key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; beneficial ownership of our ordinary shares by Jiangsu Changjiang Electronics Technology Co., Ltd. ("JCET") which may have conflicting interests with other holders of our securities; our inability to capture all or any of the benefits from acquisitions and investments in other companies and businesses or from the acquisition of us by JCET; loss of customers or failure to compete effectively with our former Taiwan subsidiaries which we have recently divested; labor union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; and natural calamities and disasters, including outbreaks of epidemics and communicable diseases. STATS ChipPAC does not intend, and does not assume any obligation to update any forward-looking statements to reflect subsequent events or circumstances. References to "$" are to the lawful currency of the United States of America.

About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is a business unit of Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET), a publicly-traded company on the Shanghai Stock Exchange. Further information is available at www.statschippac.com or www.cj-elec.com. Information contained in these websites do not constitute a part of this release.

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